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Thomas Uhrmann, director of business development, EV Group, discusses why and how wafer bonding is no longer simply a back-end integration process but now a front-end manufacturing process as well, how the company is working with lithography and other technology partners as part of this new focus, and also outlines the work being done on advanced packaging and future scaling collaboration.
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Jim Straus, Vice President of Sales, ACM Research, explains that, as the semiconductor industry continues to play a pivotal role in powering the digital revolution, it is imperative that stakeholders prioritise sustainability to mitigate environmental impacts. Overall, sustainability is becoming a driving force in the semiconductor industry, with companies such as ACM Research actively pursuing eco-friendly practices and solutions to reduce their carbon footprint.
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Clement Godfrin, imec, explains the significance of imec’s demonstration of high quality 300mm-Si-based quantum dot spin qubit processing with devices resulting in a statistically relevant, average charge noise of 0.6µeV/ÖHz at 1Hz achieved on a 300mm fab-compatible platform. The work makes large-scale quantum computers based on Si quantum dots a realistic possibility.
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Hidenori Abe, executive director of Electronics Business Headquarters, Resonac, explains the thinking behind the creation of the US-JOINT Consortium, an open consortium designed for end-customer collaboration to verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts in development. In addition, by co-creating with customers, Resonac and the US-JOINT members will capture market needs in real time, accelerating the R&D of materials and equipment technologies.
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Jorn Smeets, Managing Director North America at PhotonDelta, the Dutch photoinic chip accelerator, explains the reasons behind the opening of a new San Franciso-based North America office, as part of an ongoing strategy to help grow the global photonic chip, or PIC, industry. Jorn shares his thoughts as to how collaboration between Europe and the US will help to develop a unified photonic chip industry, best placed to meet the challenges and opportunities which lie ahead across many applications, with the industry predicted to reach a $30 billion value by 2030.
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