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SiS - 2024 Issue 9 - Part 2
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Tim Phillips, founder and CEO of Empower Semiconductor, explains how AI performance and power consumption are outpacing improvements in power delivery within the data centre, hence the company has developed the FinFast-based Crescendo vertical power platform to enable higher-performance computing with industry-leading power density, speed
and unmatched efficiency.
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Ryan Zrno, CEO of JST, discusses the ways in which the company, and the semiconductor industry more generally, is responding to the need to ensure more sustainable manufacturing alongside providing customers with the ability to develop their own more sustainable technology solutions. Ryan is excited for the future, as developments in advanced packaging and new materials, rapidly evolving application areas, such as AI and EVs, and the recent appointment of a new CTO, provide JST with some major opportunities over the coming years.
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Kurt Herremans, program director automotive at imec, discusses the thinking behind its Automotive Chiplet Program (ACP), which brings together stakeholders from across the automative ecosystem toevaluate which chiplet architectures and packaging technologies are best suited to support car manufacturers' specific high-performance computing and strict safety requirements, while striving to extend the benefits of chiplet technology – such as increased flexibility, improved performance and cost savings – to the entire automotive industry.
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