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Silicon Semiconductor Magazine - 2025 Issue 1 - Part 2
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Fabio Wörndl, Co-CEO and CMO, Siconnex, explains how the company’s perc™ solution cuts costs by eliminating solvents while achieving 100% polymer removal and also eliminates the need for solvents. perc™ offers flexible solutions for removing residues after dry etching, including metal, oxide, silicon, or VIA etching. Fabio goes on to discuss the semiconductor industry’s journey towards NetZero as well as some of the challenges and opportunities which lie ahead in 2025.
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Andy Nightingale, vice president of product management and marketing at Arteris, discusses an innovative evolution of the company’s network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of Artificial Intelligence (AI) and Machine Learning (ML) compute in system-on-chip (SoC) designs. The new functionality enables design teams to scale compute performance by more than 10 times while meeting project schedules plus power, performance and area (PPA) goals.
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Richard Terrill, VP Strategy, and Suhas Nayak, Sr. Director, Product Marketing, both at SagenceAI, explain how the company (formerly known as Analog Inference) is introducing the next leap forward for AI inference hardware. Innovations are across three aspects of in-memory compute techniques: analog multi-level flash and subthreshold compute inside flash memory cells, opening the doors for economic viability of language and vision inferencing at scale and delivering three orders of magnitude improvement in lower power consumption plus lower cost at equivalent high performance, compared to leading providers of digital inferencing silicon.
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Alexander Montgomerie-Corcoran, CEO of Heronic Technologies, explains the company’s journey from an Imperial College London spinout specialising in artificial intelligence (AI) accelerator architectures, to being selected to participate in commercial and technical discussions with ROHM Semiconductor, one of Japan’s largest electronics companies, following a recent UK-APAC Tech Growth Programme reverse pitch event.
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Description: The UPW UniCond™ resistivity sensor brings a new level of performance to UPW applications in the semiconductor industry with its best-in-class accuracy, stability, and environmental isolation in ultrapure water applications to address the evolving requirements of the semiconductor industry.
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